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Wafer

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Wafers are pieces of circular silicon chips made from pure silicon wafers (99.9999%) .

As the shapes are round, they are known as wafers.

NEXTECK provides two kinds of wafers : silicon wafers for semiconductors and silicon wafers for solar batteries.

Semiconductor wafers are measured from four to six inches. The specifications are as follows:

Items General Specification of Semiconductor Wafer
4 inch5 inch6 inch
Resistivity(Ω/cm) P-Type doped: Boron, 0.001-0.01, 0.01-0.5, >0.5 P++, P+, P-
N-Type doped: As, Phos, Sb, 0.001-1, 1-150
Diameter tolerance
(mm)
±0.2±0.2±0.2
Orientation (100), (111)(100), (110), (111)(100), (110), (111)
Orientation tolerance      ±0.15°±0.15°±0.15°
Edge ProfileT/RT/RT/R
Edge Condition11/22 Ground11/22 Ground11/22 Ground/Polished
Thickness(μm)300-650400-650550-750
Thickness tolerance
(μm)
±15±15±15
Backside TreatmentEtchPolySiO2EtchPolySiO2EtchPolySiO2
Bow(μm)±25±25(Before CVD)±25±25(Before CVD)±25±25(Before CVD)
Warp(μm)≦25≦25(Before CVD)≦25≦25(Before CVD)≦25≦25(Before CVD)
Options Laser marking, Poly-back, SiO2 seal, Back side damage




NEXTECK provides monocrystalline silicons and polysilicons in solar energy level. Customized specifications are also supplied. 

Below is some specifications of our 156mm Mono and Multi silicon wafers for your reference.

Category Mono silicon waferMulti wafer
156*156mm(Mono wafer)156*156mm(Multi wafer)
Growing methodCZ
Type PP
DopantBoronBoron
Crystal Orientation<100>+/-3 deg
Carbon content
(atom/cm3)
<5*1016<5*1017
Oxygen content
(atom/cm3)
<1.1*1018<1*1018
Etch Pit Defect
(/cm3)
<=3000
Resistivity0.5~3/3~60.5~3
Minority Carrier Lifetime
(microsecond (μs) )
>10>=2
Dimension (mm)156+/-0.5156+/-0.5
Thickness (μm)200+/-20200+/-20
TTV (μm)<=30<=30
Bow/Warp (μm) <100<50 / <100
Edge (Chip)Depth≤0.5mmDepth≤0.5mm
Vertical≤1.0mmVertical≤3.0mm
Defect≤2Defect≤2

 


Each items of NEXTECK win years of accumulation and trust.Products used for semiconductors and electronic parts are very completed and with varied shaping methods , excellent forming property and size precision.