Nexteck heat spreaders(TIM) are made from high-performance ceramic materials, offering excellent thermal conductivity and electrical insulation.

They are widely used in automotive electronics and AI chip applications, providing stable and efficient thermal management solutions.

Features

Electrical insulation + Low thermal resistance

- Replacing PET film with high-hardness thermal interface sheet

Softness + High Recovery

With 100% recovery rate & Asker C 8 softness, it fills gaps and prevents an increase in contact thermal resistance!

- Eliminating Gaps with Thermal Spacer FSL-BS

Due to repeated compression and release, gaps can form between the heat source...

By applying NEXTECK Thermal Spacer FSL-BS, it's possible to achieve low thermal resistance by conforming to even minute gaps.

A wide range of high-performance thermal materials is available to meet diverse application needs:

- High thermal conductivity gap fillers: up to 14 W/mK

- High resilience materials: combining thermal performance and compressibility

- Premium insulated thermal sheets: up to 10 W/Mk

FSL-P1 - 14W/mK

BFG-D - 10W/mK

FSL-R1 - 9W/mK & Asker C15 (Next-generation of FSL-BS)