The rapid growth of AI is transforming the semiconductor industry toward a fully integrated supply chain. According to Counterpoint Research, the global Foundry 2.0 market, covering wafer fabrication, packaging, testing, and photomask production, reached US$320 billion last year, representing 16% year-over-year growth.
As AI chips demand higher performance and integration, advanced packaging has become a critical factor affecting chip performance, manufacturing efficiency, and time-to-market. Nexteck provides high-performance Dicing Tape solutions designed to enhance wafer cutting process stability and support advanced semiconductor packaging applications.
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